Depending on the type of the devices, such as video cards, motherboards, processors or any other electronic components, we have developed various ways to improve the corresponding cooling systems.
- For example, for routers and devices for wireless networks, in addition to increasing the number of heatsinks, the technology of filling radio modules with a thermally conductive compound is used.
- Thermal grease in video cards is replaced by a higher quality one, and thermal pads are replaced by industrial elastic thermal interface with high thermal conductivity, which guarantees an optimal fit to the components and does not have an expiration date.
- For cooling motherboards, various combinations of additional heatsinks, elastic thermal interface and heat-conducting epoxy glue with boron nitride are used.
All modified devices undergo extensive testing under maximum load while being controlled by a high-resolution infrared camera.
